DPSS

ULYXE FAMILY

The Ulyxe product line provides ideal laser marking solutions for both stand-alone applications and industrial production lines. Integrated 6.5W DPSS laser marking system, due to its cost-effective, innovative design, Ulyxe becomes the first choice in marking solutions by providing the best price/ performance for plastic and metal marking applications.

Features & Benefits

Extreme compactness offering all the most advanced technological concepts

Best price / performance ratio in the laser marking world

Air cooled with ultra-compact design

Integrated scanning head, digital control and monitoring functions

Applications

This product series has been developed to satisfy to requirements of the following reference applications:

Label marking

Direct Part Marking (DPM)

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VLASE

The NEW VLASE is a complete family of Diode Pump Solid State laser marking products available in three different wavelengths: 1064, 532, 355 nm, with power up to 20 W. The New VLase family, based on the unified ONE.RACK control platform, is available with compact, air cooled high performance, high peak power Solid State laser sources, suitable for demanding industrial applications and hard-to-engrave materials.   The NEW VLASE family is available only on “Marking” configuration

Features & Benefits

Extremely easy to integrate and configure

Excellent beam quality

High peak power and short pulse width for excellent marking on a broad range of materials

3 or 5 meters detachable optical fiber

4 axis embedded controller

Applications

This product series has been developed to satisfy to requirements of the following reference applications:

High stability thermoplastic marking

High reflectivity metal marking in electronics and automotive industries

Thin film and coating ablation

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GREEN LASE

The Green-Lase family offers 4W and 10W DPSS laser marking sources @532 nm operating on the Lase platform and uses SHG in an intracavity architecture which maximizes LBO non-linear crystal conversion efficiency. The Green-Lase sources offer all the advantages of Datalogic Automation Lase Platform such as air cooling, standard compact design, continuous and precise power control and low power consumption. The Green-Lase sources guarantee very high beam quality and M2<1.2 and is distinguished by long term power stability as well as by pulse-to-pulse stability. The Green Lase is available both in Marking as well as in OEM configuration.

Features & Benefits

High flexibility to integrate and configure

High reliability

Lower ``heat affected zone``

State-of-the-art marking kit including user friendly marking software

Power up to 10W

Applications

This product series has been developed to satisfy to requirements of the following reference applications:

Marking of plastic (which is not sensitive to IR) and thin film ablation

Marking of silicon and semiconductors in the electronics industry

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UV LASE

The extra cavity technology allows high efficiency conversion of the LBO nonlinear crystal and compactness of the laser source.
The UV combines unique features such as air cooling, standard compact design, continuous and precise power control and low power consumption with the advantages of the short UV wavelength. Performing the ‘so called’ cold marking the UV Lase allows no-damage marking and micro-processing on demanding materials such as glass, non –doped plastics, coatings, among the others. The UV Lase is available both in Marking as well as in OEM configuration

Features & Benefits

Based on the state-of-the-art V-Lase platform

Integrated advanced diagnostics

Easy setup and configuration

Air cooled industrial compact design for:

  • Highest industrial grade reliability
  • Long life running
  • Unmatched MTBF
  • Easy integration and maintenance

Optimized for marking and processing applications

  • Excellent beam quality and roundness
  • New RF FPK methodology for fast marking
  • Highly configurable customizable
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Applications

This product series has been developed to satisfy to requirements of the following reference applications:

Special material processing, such as glass marking for traceability purposes in automotive

Heat sensitive applications in the electronics, aerospace and solar industries

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